From ec12492ea74094db568baef47dc5a3f13e456c0f Mon Sep 17 00:00:00 2001 From: hermes-agent Date: Fri, 28 Aug 2026 17:09:19 +0000 Subject: [PATCH] Build Release config so .ipa bundle id matches source metadata Debug config produces com.voidlink.tf.debug10.iOS, which mismatches the com.voidlink.tf.iOS declared in VoidLink.json, so SideStore rejects the install. Release produces the matching com.voidlink.tf.iOS. --- .gitea/workflows/build.yml | 4 +++- 1 file changed, 3 insertions(+), 1 deletion(-) diff --git a/.gitea/workflows/build.yml b/.gitea/workflows/build.yml index cc8e9c1a..5dfa37ee 100644 --- a/.gitea/workflows/build.yml +++ b/.gitea/workflows/build.yml @@ -31,10 +31,12 @@ jobs: run: | # Build the app (no signing — SideStore signs on-device). # VoidLink's scheme is auto-generated from the VoidLink target. + # Release config → bundle id com.voidlink.tf.iOS (Debug uses + # com.voidlink.tf.debug10.iOS), so the .ipa matches the metadata. xcodebuild \ -scheme VoidLink \ -sdk iphoneos \ - -configuration Debug \ + -configuration Release \ archive \ -archivePath $PWD/build/VoidLink.xcarchive \ CODE_SIGN_IDENTITY="" \